In fact, Apple actually increased the die size of Apple Silicon for iPhones, iPads, and Macs in order to be able to increase the amount of SRAM (e.g. And that means cramming more hardware components, whilst also increasing the amount of SRAM, and whilst making the die smaller, is becoming exponentially difficult.Īnd despite Apple having really good engineers, Apple's not immune to the problems with scaling down SRAM with more advanced process nodes. In fact, SRAM scaling has practically stopped with the introduction of TSMC's N3 process node family. L1, L2, 元 cache, etc.) becomes due to the laws of physics. Click to expand.The more advanced a process node is, the more difficult the process of scaling down the size of SRAM (e.g.
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